A |
B |
C |
D |
E |
F |
G |
H |
I |
J |
K |
L |
M |
N |
O |
P |
Q |
R |
S |
T |
U |
V |
W |
X |
Y |
Z |
ALL
|
Exterior Defect
|
(1) A counterfeit indicator. (2) Defects related to product packaging and/or shipping (e.g. invalid date or lot code, paperwork, product labels, etc.); part leads, balls or columns (e.g. oxidation, exposed copper, scratches, dents, etc.); package (e.g. unidirectional abrasions/sanding, burn marks, inconsistent texture, package mold variations, etc.)
See: Physical Defect, Interior Defect
Note: “Exterior defects are related to packaging/shipping, leads/balls/columns, and package of a component. The most obvious defects will be ones that are associated with the packaging or shipping the parts arrived in. The leads/balls/columns of an IC can show how the part has been handled if it was previously used. Physically, they should adhere to datasheet specifications, including size and shape. The final coating on the leads should conform to the specification sheet. The package of an IC can reveal significant information about the chip. As this is the location where all model numbers, country of origin, date codes, and other information are etched, counterfeiters will try to be especially careful not to damage anything and to keep the package looking as authentic as possible.”"
|
| Source: “Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead” by Ujjwal Guin, Daniel DiMase and Mohammad Tehranipoor
|
|